发明名称 LID FOR MICRO-ELECTRO-MECHANICAL DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess. Hence, the shielding effect upon the micro-electro-mechanical device is enhanced.
申请公布号 US2010108345(A1) 申请公布日期 2010.05.06
申请号 US20090604907 申请日期 2009.10.23
申请人 UNIMICRON TECHNOLOGY CORPORATION 发明人 HSU SHIH-PING;TSAI KUN-CHEN;IVAN MICALLAEF
分类号 H05K5/00;B05D5/12;H05K13/00 主分类号 H05K5/00
代理机构 代理人
主权项
地址