发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME |
摘要 |
A stiffener is provided for use in making semiconductor devices. The stiffener and method of use provided prevent or reduce warpage of a semiconductor package during the assembly process. More particularly, the stiffener functions to prevent or reduce warpage during molding of an assembly of wafers and/or dies. The stiffener may be positioned above the backside or non-active side of an assembly of wafer and/or dies during molding. The presence of the stiffener prevents or reduces warpage caused by CTE mismatch between the mold material and the wafer and/or under the high temperatures encountered in the process of molding. After molding, the stiffener may continue to provide support to the assembly.
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申请公布号 |
US2010109169(A1) |
申请公布日期 |
2010.05.06 |
申请号 |
US20090431363 |
申请日期 |
2009.04.28 |
申请人 |
UNITED TEST AND ASSEMBLY CENTER LTD |
发明人 |
KOLAN RAVI KANTH;SUN ANTHONY YI-SHENG;TOH CHIN HOCK;NG CATHERINE BEE LIANG;ZHANG XUE REN |
分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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