| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder DIP tank device that suppresses solder bridging between mounted electronic component lands by intentionally changing fluidity of solder and cutting the solder not linearly but at a point, when DIP soldering is carried out. SOLUTION: A conveying means 52 supports a printed circuit board 1 at both ends parallel with a conveying direction A of the printed circuit board 1, and a jet stream port 5 of a DIP solder tank 51 is in a mountain shape having a peak 7 on the side in the conveying direction A of the printed circuit board 1 in plan view, so concentration of solder 4 on a bent portion of the printed circuit board 1 is avoided to suppress solder bridging between electronic component lands 2 or solder extension lands 3. COPYRIGHT: (C)2010,JPO&INPIT |
