| 摘要 |
<p>1,001,171. Semi-conductor devices. WESTINGHOUSE ELECTRIC CORPORATION. Sept. 18, 1963 [Sept. 21, 1962], No. 36691/63. Heading H1K. A sealed semi-conductor device comprises a base member having a thin semi-conductor wafer, leads from the wafer extending to terminal pins extending through the base member and connected to terminal strips on the other side of the base member, a flanged frame with a cover plate also being joined to the base member. Figs. 1 and 2 show a semi-conductor body 18 joined to a metallized area on ceramic base member 12. A flanged frame member 16 is bonded to base 12 and an iron-nickel-cobalt alloy plate 22 is welded or brazed to member 16 at peripheral lip 23. Leads 20 are connected via pins 14 and leads 19 to various areas on the semi-conductor body which may comprise a plurality of functional elements forming a solid circuit. The base may consist of alumina, beryllia, porcelain or high silica glass, or ceramic coated metal such as molybdenum, tungsten, nickel-iron-cobalt alloy or copper alloy. The leads may consist of copper, or nickel-cobalt-iron alloy.</p> |
