发明名称 Film forming method, and substrate-processing apparatus
摘要 A film forming method comprising forming a liquid coating film on a substrate by supplying a liquid containing a coating type thin film forming substance and a solvent onto the substrate, substantially converging a variation in film thickness of the coating film, making the coating film stand by in an atmosphere including moisture under a predetermined condition after the substantial-convergence, the predetermined condition being such that a product of a time for which the coating film is exposed to the atmosphere and a water content per unit volume in an atmosphere in the vicinity of a surface of the coating film is made to be greater than or equal to a predetermined value, and forming a solid thin film on the substrate after the stand-by, the thin film being formed by carrying out an elimination of the solvent in the coating film and heat treatment for generating an irreversible reaction to the coating type thin film forming substance in the coating film.
申请公布号 US7709383(B2) 申请公布日期 2010.05.04
申请号 US20050034926 申请日期 2005.01.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KATO HIROKAZU;TAKEISHI TOMOYUKI;ITO SHINICHI
分类号 G03F7/16;H01L21/20;B05C9/12;B05C13/00;B05D3/00;B05D3/02;G02F1/136;G03F7/09;G03F7/11;G03F7/26;G03F7/38;H01L21/00;H01L21/027;H01L21/312;H01L21/44;H01L21/469 主分类号 G03F7/16
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