| 摘要 |
PURPOSE: A manufacturing method of an image sensor is provided to improve the coherence between substrates by removing the organic layer after bonding by arranging the organic layer between substrates. CONSTITUTION: A readout circuit is formed in a first substrate(100). A wiring(150) is formed on the readout circuit. A first organic layer(220) is formed on the wiring. A second organic layer(230) is formed on a second substrate(200). An organic layer and an image sensing device are formed by bonding the first organic layer and the second organic layer. The organic layer is removed by executing a thermal process for the first substrate and the second substrate.
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