| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows thinning and downsizing and furthermore meets a requirement for heat resistance. <P>SOLUTION: A circuit board has a resin film whose surface is formed with a silicon nitride or a silicon oxynitride film and further includes a copper-based metal layer forming an electrode pattern. Electronic parts are mounted on the electronic pattern, and a whitish layer is formed in an area other than a mount region of the electronic parts in a mount plane of the electronic parts on the circuit board. This arrangement requires only a small light-emitting component for a given light quantity, which provides an advantage for thinning and downsizing, and what is more, reduces heat generation to provide an advantage in heat resistance. <P>COPYRIGHT: (C)2010,JPO&INPIT |
