| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a semiconductor device at low cost, without reducing the heat dissipation efficiency of the semiconductor chip included by a semiconductor device. <P>SOLUTION: A semiconductor chip 3 is arranged on the front surface of a plate-like stage part 5, and the semiconductor chip 3 is electrically connected with two or more leads 7 arranged around the semiconductor chip 3 by wires 9. Furthermore, the semiconductor chip 3, the stage part 5, the leads 7, and the wires 9 are fixed and constituted integrally by resin mold. The leads 7 are arranged upper than the front surface of the stage part 5. At the backside of the stage part 5, a plate-like heat dissipation stage part 13 is fixed so as to expose only the backside 13b to outward of a resin mold 11, while having an area larger than this backside. A part of the heat dissipation stage part 13 projects from a periphery of stage part 5. A through-hole 52 is formed to penetrate in a thickness direction of the heat dissipation stage part 13 in a projection portion of the heat dissipation stage part 13 facing the leads 7, and thus a semiconductor device 51 in which the through-hole 52 is filled up with the resin mold 11 is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
