CORELESS SUBSTRATE HAVING FILLED VIA PAD AND A FABRICATING METHOD THE SAME

摘要

PURPOSE: A coreless substrate and a manufacturing method thereof are provided to reduce a process time by using a carrier with a releasing layer and removing an etching process. CONSTITUTION: A build-up layer(130) comprises a build up circuit layer which has a build up insulating layer and a build up via. A first insulation layer(120) and a second insulation layer(140) are formed in the outermost layer of both sides of the build-up layer. A first field via-pad(152a) and a second field via-pad(152b) are respectively formed in the first insulation layer and the second insulation layer. The first field via-pad and the second field via-pad are buried to the same height as the surface of the second insulation layer and the first insulation layer. The first field via-pad and the second field via-pad are faced with each other.