发明名称 Method for positioning a wafer
摘要 The invention relates to a method for positioning a wafer (3) with a reference mark (6) in a vacuum processing unit with a transport chamber containing a transport device (2, 20, 21) for moving the wafers (3) in a plane to a process chamber arranged on said chamber and a single sensor (1), arranged within the transport chamber before the process chamber for recording the position of the wafer (3) by means of recording the edge thereof at a first detection point (4) and a second detection point (5), such that the actual position of the wafer (12) with a known wafer diameter can be determined with electronic analysis of both measured detection points (4, 5) and the transport device (2, 20, 21) guides the wafer (3) to a desired set position. The wafer (3) is aligned in a given position on the transport device (2, 20, 21) in relation to the reference marks (6) thereof and the projection of the reference marks (6) determines a non-permitted zone (22) along a direction of movement on the wafer (3) and hence defines a free zone on the remainder of the wafer (3). The sensor (1) is arranged in the transport chamber such as to guarantee that the non-permitted zone (22) is not scanned and the sensor (1) can thus only record the circular art of the wafer edge and not parts of the reference mark (6).
申请公布号 US7706908(B2) 申请公布日期 2010.04.27
申请号 US20060815741 申请日期 2006.01.09
申请人 OC OERLIKON BALZERS AG 发明人 SCHOLTE VAN MAST BART;CHRIST HOLGER;SCHMUCKI RUEDI
分类号 G06F19/00;H01L21/677 主分类号 G06F19/00
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