| 摘要 |
PURPOSE: A semiconductor chip package is provided to improve a lifetime and a property of a semiconductor product by decreasing an average temperature. CONSTITUTION: A semiconductor chip package(30) comprises a semiconductor chip(160), an encapsulating material(150), a heat sink member, and a heat dissipation lead(330). The encapsulating material covers the semiconductor chip. The heat sink member is adjacent to the encapsulating material. The heat dissipation lead passes through the encapsulating material. One end of the heat dissipation lead is contacted with the heat sink member and the other end thereof is adjacent to the semiconductor chip.
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