| 摘要 |
PURPOSE: A PCB integrated with a soft silicon pad for the high speed heat diffusion of an LED and a method for manufacturing the same are provided to expand the life expectancy of the LED and improve light efficiency by effectively emitting the heat from the LED to the outside of the lighting apparatus. CONSTITUTION: A PCB(123) includes a PCB hole. The PCB hole is formed on the location which the heat emitting surface of an LED is mounted. When an LED is mounted on the center of the PCB hole, a soft silicon(125) contacts to the heat emitting surface of the LED. When a heat sink(101) is mounted on the opposite side of the PCB on which the LED is not mounted, the soft silicon is formed with an uniform thickness in order to be closely adhered to the heat sink of a lighting case.
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