| 摘要 |
PURPOSE: A via hole processing device using a laser is provided to reduce vibration and increase work speed by installing two or more scan heads on one line. CONSTITUTION: A via hole processing device using a laser comprises a frame, a fixed table(14), a scan head module(27), and a laser module. The scan head module moves in the straight line at a right angle to the traveling direction of the fixed table. The two or more scan heads(11a,11b) are mounted in the scan head module. The laser module comprises a laser generator(10), a mirror, and a beam splitter(17). |
