SEMICONDUCTOR APPARATUS OF FURNACE TYPE

摘要

PURPOSE: A furnace type semiconductor apparatus is provided to form a uniform thin film between wafers by forming a gas spray hole with the same size for spraying the gas to a wafer. CONSTITUTION: A furnace type semiconductor apparatus includes a wafer boat(200), a nozzle(412), and a spray hole. The wafer boat is located inside a process tube(100). The nozzle is comprised of wafers loaded on the wafer boat. The nozzle has the spray hole for spraying the process gas at different height. The spray hole has the same length to make the process gas staying distance equal.