发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE: A positive type photosensitive resin composition is provided to ensure high sensitivity, high definition, good pattern, excellent residue removal property, and excellent film uniformity and to maintain the balance of viscosity and solid content. CONSTITUTION: A positive type photosensitive resin composition comprises (A) a polybenzoxazole precursor having a repeating unit represented by chemical formula 1, (B) a photosensitive diazoquinone compound, (C) a silane compound, (D) a dissolution modifier, and (E) a solvent. The dissolution modifier is selected from the group consisting of an alicyclic alcohol compound, an aromatic alcohol compound with a alicyclic ring, and combinations thereof.
申请公布号 KR20100039009(A) 申请公布日期 2010.04.15
申请号 KR20080098202 申请日期 2008.10.07
申请人 CHEIL INDUSTRIES INC. 发明人 JONG, JI YOUNG;JUNG, DOO YOUNG;YOO, YONG SIK;CHO, HYUN YONG;CHUNG, MIN KOOK;LEE, JONG HWA;LEE, KIL SUNG;CHA, MYOUNG HWAN
分类号 G03F7/039 主分类号 G03F7/039
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