| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a template manufacturing method, forming a pattern having desired dimensions with good accuracy, a method of manufacturing a semiconductor device and a template for manufacturing the semiconductor device. Ž<P>SOLUTION: This template manufacturing method includes a process of determining dimensions of a recess pattern to be formed on a template substrate with reference to the relationship between the dimensions of a projection-like resist pattern, or a dimensional difference between the resist pattern and the recess pattern of the template and the dimensions of the recess pattern of the template; and a process of forming a recess pattern on the template substrate according to the determined dimensions. In the method, the projection-like resist pattern is formed by filling the recess pattern with a pattern forming material with the template having the recess pattern contacting the pattern forming material formed on the substrate, curing the filled pattern forming material, and separating the template from the pattern forming material. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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