发明名称 METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE OBTAINED THEREBY
摘要 PROBLEM TO BE SOLVED: To provide a method for efficiently producing a semiconductor substrate in which a smooth semiconductor layer is formed by baking a printed layer containing copper nano-particles disposed on a base material at a low temperature for a short time. SOLUTION: The method for producing the semiconductor substrate includes a step of forming the printed layer by printing a pattern with a coating solution containing copper nano-particles and then a step of forming the pattern of the semiconductor layer by baking the printed layer, wherein the printed layer is baked by exposing the printed layer to the surface-wave plasma generated by an application of a microwave energy under an atmosphere containing oxygen. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010087287(A) 申请公布日期 2010.04.15
申请号 JP20080255549 申请日期 2008.09.30
申请人 DAINIPPON PRINTING CO LTD 发明人 HOJO MIKIKO
分类号 H01L21/368;G02F1/1333;G02F1/1343;G02F1/1362 主分类号 H01L21/368
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