发明名称 |
METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE OBTAINED THEREBY |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently producing a semiconductor substrate in which a smooth semiconductor layer is formed by baking a printed layer containing copper nano-particles disposed on a base material at a low temperature for a short time. SOLUTION: The method for producing the semiconductor substrate includes a step of forming the printed layer by printing a pattern with a coating solution containing copper nano-particles and then a step of forming the pattern of the semiconductor layer by baking the printed layer, wherein the printed layer is baked by exposing the printed layer to the surface-wave plasma generated by an application of a microwave energy under an atmosphere containing oxygen. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010087287(A) |
申请公布日期 |
2010.04.15 |
申请号 |
JP20080255549 |
申请日期 |
2008.09.30 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
HOJO MIKIKO |
分类号 |
H01L21/368;G02F1/1333;G02F1/1343;G02F1/1362 |
主分类号 |
H01L21/368 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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