发明名称 WAFER SCALE LENS, WAFER SCALE CAMERA MODULE AND ELECTRONIC DEVICE
摘要 A protruding section (11) which protrudes higher than the highest position of a lens optical surface (14) is formed outside the lens optical surface (14) on a lens wafer (1).  Thus, the lens wafer (1), a wafer scale camera module (100) and an electronic device, which can perform accurate imaging test, while eliminating lens breakage, are provided.
申请公布号 WO2010041579(A1) 申请公布日期 2010.04.15
申请号 WO2009JP67057 申请日期 2009.09.30
申请人 SHARP KABUSHIKI KAISHA;SAITOH, HITOSHI;KAMADA, TOHRU;YANO, SHUHJI 发明人 SAITOH, HITOSHI;KAMADA, TOHRU;YANO, SHUHJI
分类号 H01L27/14;G02B3/00;H04N5/225;H04N5/335 主分类号 H01L27/14
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