Silicone resin composition for optical semiconductor devices

摘要

The present invention provides a silicone resin composition for an optical semiconductor device, comprising
(A) 100 parts by weight of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1),
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ (CH 3 ) a Si(OR 1 ) b (OH) c O (4-a-d-c)/2 €ƒ€ƒ€ƒ€ƒ€ƒ(1)
wherein R 1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8 ‰¦ a ‰¦ 1.5, 0 ‰¦ b ‰¦ 0.3, 0.001 ‰¦ c ‰¦ 0.5, and 0.801 ‰¦ a + b + c < 2,
(B) 3 to 200 parts by weight of a white pigment,
(C) 400 to 1000 parts by weight of an inorganic filler other than said white pigment,
(D) 0.01 to 10 parts by weight of a condensation catalyst, and
(E) 2 to 50 parts by weight of an organopolysiloxane comprising a linear diorganopolysiloxane moiety represented by the following formula (2),
wherein R 2 and R 3 are, independently of each other, a group selected from the group consisting of a hydroxyl group, an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, a vinyl group, a phenyl group and an allyl group, and wherein m is an integer of from 5 to 50.