发明名称 LID FOR USE IN PACKAGING AN ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE LID
摘要 A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10-500 mum and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.
申请公布号 KR100952096(B1) 申请公布日期 2010.04.13
申请号 KR20030049580 申请日期 2003.07.19
申请人 发明人
分类号 H01L23/02;H01L23/28;H01J5/00;H01L23/04;H01L23/10;H01L41/02;H03H9/02;H03H9/10 主分类号 H01L23/02
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