APPARATUS FOR SLICING WAFER

摘要

PURPOSE: An apparatus for slicing a wafer is provided to prevent foreign materials from flowing through a gap between roller shafts and a spindle shaft by sealing the gap between the roller shafts and the spindle shaft. CONSTITUTION: The both ends of a plurality of roller shafts(22) are combined to a pair of support frames. A plurality of spindles(30) includes a spindle body(31), a spindle shaft(32) and a bearing(33). The spindle shaft is combined to the roller shafts and is inserted into the hollow part of the spindle body. The bearing is interposed between the spindle body and the spindle shaft and supports the spindle shaft to be rotatable. An o-ring is interposed between the roller shafts and the spindle shaft.