| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a device for packaging an element with heat dissipation structure which form a fillet large, the fillet being formed at the distal end of the heat dissipation structure, in packaging of the element with the heat dissipation structure by a reflow system and thereby improve visibility in a visual inspection and a camera image inspection. Ž<P>SOLUTION: The device for packaging the element with the heat dissipation structure includes: a packaging machine which slides the element 21 in a state wherein the distal end of a heatsink terminal 22 contacts the edge of solder S to the side of the solder S, and collects the solder S to put a solder amount of the distal end side of the heatsink terminal 22 into a state wherein it is locally increased; and a reflow furnace which is a soldering device which melts the solder S to solder a substrate 11 and the element 21 while the element 21 is slid to the side of the solder S by the packaging machine. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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