| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module that is manufactured at a low cost and has high reliability, and to provide a method of sealing the same with resin. Ž<P>SOLUTION: The semiconductor module has: a wiring board comprising an insulating substrate provided with a wiring pattern which is coated with a solder resist to be protected; and a semiconductor device provided with a connection terminal that is mounted on the wiring board and electrically connected with the wiring pattern. The space between the semiconductor device and the wiring board is sealed with a sealing resin. A frame is provided for surrounding at least part of the outer periphery of the position of mounting the semiconductor device and comprising a solder resist forming a removal part in the vicinity of the outer peripheral edge. The sealing resin covers the top of the frame from the space between the semiconductor device and the wiring board, and coats up to the outer end of the removal part. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
