| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having a low dielectric constant and dielectric loss tangent and excellent heat resistance and flame retardancy of a cured product, and to provide the cured product of the composition. SOLUTION: The epoxy resin composition comprises, as essential components, an epoxy resin (A) using both of a bisphenol epoxy resin (a1) and a polyfunctional naphthalene-based epoxy resin (a2) such as 1,1-bis(2,7-diglycydyloxy-1-naphthyl)alkane, and a curing agent (B), wherein an active ester resin (b) expressed by general formula 1 is used as the curing agent (B). In the formula, X represents a hydrogen atom, an alkyl carbonyl group or an aryl carbonyl group; R<SP>1</SP>represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R<SP>2</SP>represents a hydrogen atom or a methyl group; n represents an average of repeating units and ranges from 0 to 10; where, at least one of X is an alkylcarbonyl group or an aryl carbonyl group. COPYRIGHT: (C)2010,JPO&INPIT
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