发明名称 METHOD FOR SCRIBING SUBSTRATE OF FRAGILE MATERIAL
摘要 <p>Provided is a scribing method, wherein abnormal destruction or generation of burs due to poor cutting phenomenon do not tend to occur. A scribing method of a substrate (10) of fragile material comprises forming, in the surface of the substrate, an outline scribe line consisting of a closed curve constituting the outline of a product to be cut out, and forming an auxiliary scribe line for assisting division on the outside of the outline scribe line, wherein auxiliary scribe lines (12a-12d, 13a-13d) are directed in the tangential direction of outline scribe lines (11a-11c) and a non-scribe region having a distance of 2 mm or less is left between the auxiliary scribe line and the outline scribe line.</p>
申请公布号 WO2010038563(A1) 申请公布日期 2010.04.08
申请号 WO2009JP64705 申请日期 2009.08.24
申请人 KAWABATA, TAKASHI;MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.;SAKAGUCHI, RYOTA;MURAKAMI, KENJI 发明人 KAWABATA, TAKASHI;SAKAGUCHI, RYOTA;MURAKAMI, KENJI
分类号 B28D5/00;C03B33/04 主分类号 B28D5/00
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