| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat conductive molded body which can be manufactured easily and inexpensively without needing complicated processing and processing equipment and is suitable also for application to structure such as housing. <P>SOLUTION: The heat conduction molded item 1 in produced by molding a resin composition containing 5-80 vol% of a tabular inorganic filler, and includes a hole 2 in a thickness direction of the molded item; the hole is formed by a mold. The hole 2 is a through-hole or includes 70% or more of a depth to an average thickness T of the molded item. In a unit volume (9×T<SP>3</SP>) fraction optionally taken out from the molded item, an area A of a wall formed by the hole satisfies the following inequality (1): A≥4×T<SP>3</SP>. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
