| 摘要 |
PURPOSE: A photosensitive resin composition is provided to ensure excellent flatness, sensitivity, heat resistance, transparency, and adhesion while obtaining an organic insulating film of a low permittivity. CONSTITUTION: A photosensitive resin composition for an organic insulating film comprises [A] an alkali soluble resin, [B] an unsaturated ethylene-based monomer, [C] a silsesquioxane compound of chemical formula 1, [D] a photopolymerization initiator and [E] a solvent. |
