发明名称 IMAGE SENSOR AND MANUFACTURING METHOD OF IMAGE SENSOR
摘要 PURPOSE: An image sensor and a manufacturing method of an image sensor are provided to improve the operation reliability of an image sensor since a high temperature annealing is not necessary. CONSTITUTION: A semiconductor substrate(100) has a photo diode(110) and a transistor(120). More than one interlayer dielectric layer(130) are formed on the semiconductor substrate. The interlayer insulating layer comprises a contact plug and a metal wiring. The first protective layer(140) is formed on the interlayer dielectric layer. A metal layer(150) is formed on the first protective layer and functions a light-shielding layer. A second protective layer(160) is formed on the metal layer. A micro lens(170) is formed on the second protective layer which vertically corresponds to a photo diode.
申请公布号 KR20100036674(A) 申请公布日期 2010.04.08
申请号 KR20080096013 申请日期 2008.09.30
申请人 DONGBU HITEK CO., LTD. 发明人 PARK, JEONG SU
分类号 H01L27/146 主分类号 H01L27/146
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