| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board which can eliminate the need for a desmearing process when an opening is formed by a laser in a resin insulating layer. SOLUTION: A laser is transmitted through a laser transmission plate 246 and water 244 to form an opening 71 in a resin insulating layer 70. Since the surface of the resin insulating layer 70 is covered with the water 244, the resin insulating layer 70 is shielded from air, and smear formation is less. Further, temperature rise can be suppressed by the endothermic action of the water 244, and no smear takes place in a conductor circuit 58 at the bottom of the opening 71. Thus, the need for a desmearing process can be eliminated. COPYRIGHT: (C)2006,JPO&NCIPI |
