| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for processing a semiconductor wafer, capable of adhering a stripping tape to an adhesive sheet to make the adhesive sheet peelable, so that part of the adhesive sheet protruded from a semiconductor wafer may not be stuck to a mounting sheet. SOLUTION: The semiconductor wafer processing device includes a mounting means 11 to integrate a semiconductor wafer W with an adhesive sheet S stuck via a mounting sheet S by placing the semiconductor wafer W inside a ring frame RF; a detection means 12 to detect a distance L from the outer edge circumference of the ring frame RF to the outer edge circumference We of the semiconductor wafer W; a stripping means 13 to conduct stripping by sticking a stripping tape PT on the adhesive sheet S; and a control means 15 to control the stripping means 13 based on the distance L, wherein the control means 15 specifies the adhering position of the stripping tape PT based on the distance L and controls the peeling of the adhesive sheet S while the stripping tape PT is stuck on the position. COPYRIGHT: (C)2010,JPO&INPIT |
