| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board with built-in components which can obtain high productivity and reduced cost, and can maintain reliability even if a plurality of kinds of components are embedded and mounted therein in a mixed state. <P>SOLUTION: This wiring board with built-in components comprises: a first laminate insulating layer 11 and second laminate insulating layers 12, 13, 14, 15; a semiconductor element having surface mounted terminals embedded in the second laminate insulating layers 12, 13, 14. 15, and a chip-like part; a wiring pattern having first and second lands sandwiched between the first and second insulating layers; and first and second connection members which electrically connect the semiconductor element and the chip-like part with the first and second lands, respectively. The second connection member includes: a cured resin part; a metal included in the cured resin part and having a melting point of not higher than 240°C; second metal particles whose surfaces are covered with a plurality of element system phases of a first metal whose melting point becomes not lower than 260°C as a result that a first metal being one of composition metals changes into the plurality of element system phases including a second metal; and a conductive part which is formed in a conductive framework structure in a way that a plurality of element system phase are connected with one another in the resin part. <P>COPYRIGHT: (C)2010,JPO&INPIT |
