| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can fully meet the requirement even when the number of external connection terminals needs to be increased due to high packaging and to provide a production process thereof. <P>SOLUTION: A semiconductor device 10 includes chips 30, 32 which are laminated in a face-down and face-up mode respectively to an opening OP of a lead frame 20. An electrode pad 33 of the chip 32 is connected to a lead 22 through a wire 34. Furthermore, a laminated wiring layer 40 having the chip 30 and the lead frame 20 mounted on one of the sides and a sealing resin layer 50 which seals the chips 30 and 32, the lead frame 20, or the like are also included. The wiring pattern drawn from the electrode pad 31 and lead 22 of the chip 30 is electrically connected to a pad 44P which is arranged at the other side of the laminated wiring layer 40. <P>COPYRIGHT: (C)2010,JPO&INPIT |
