| 摘要 |
<p>1,104,515. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. 9 Aug., 1965 [8 Aug., 1964], No. 34085/65. Heading H1K. A semi-conductor body is clamped between pressure members via members the expansion coefficient of which matches that of the body. The members are bonded to the body and a synthetic resin covering extends around the periphery of the member-body assembly on to opposite end faces of the members. In an embodiment the semi-conductor body is of lightlydoped P-type silicon with heavily doped P and N type surface zones. The members are mushroom-shaped and after their attachment, by alloying or soldering, to the surface zones the silicon body is peripherally etched and the resulting recess between the heads of the members filled with alizarin in a synthetic resin. The resin covering, e.g. of epoxy, polyester or silicone which is then applied to form a U-section ring about the device may be keyed to the outer faces of the mushroom heads with the aid of grooves, elevations or depressions therein.</p> |
