ACOUSTIC SIGNAL/ELECTRIC SIGNAL CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to an acoustic signal/electric signal conversion device and a manufacturing method thereof.  Dynamic application and implementation of the present invention involves: changing a sacrificial layer, a base body for forming a cover plate, into a polymer-based material that can easily be produced/removed at a low temperature; changing the cover plate formation procedure into an electroplating procedure that can proceed at a low temperature; additionally forming an anti-adhesion dimple for blocking adhesion of a vibrant plate onto a part of the cover plate; additionally depositing a dielectric layer on the contact interface between the cover plate and a substrate, for reinforcing insulation; and forming a back chamber by a double process including Deep-RIE(Deep Reactive Ion Etching) and anisotropic etching.  In this manner, creating a one-step manufacturing process of an acoustic signal/electric signal conversion device and a signal processing chip, preventing the occurrence of problems due to the adhesion between the cover plate and the vibrant plate, reducing an amount of parasitic capacity generated, maximizing the scale of a back chamber, and the like are realized effectively, and these may, in turn, guide manufacturers to easily avoid damages by dual independent manufacturing environments of the acoustic signal/electric signal conversion device and the signal processing chip, damages by the adhesion between the cover plate and the vibrant plate, damages by an increased amount of parasitic capacity, damages by a diminished scale of the back chamber, and the like.