| 摘要 |
PURPOSE: A substrate bonding device including a pressure cleaning unit is provided to remove an adhesive agent on a pressure plate by including a cleaning unit. CONSTITUTION: A disk is received on the upper side of a hot plate(40). At least one pressure unit(70) loads a substrate and includes a pressure plate for pressurizing the substrate in contact with the disk on which an adhesive agent is sprayed. A rotation shaft(100) is rotated. A connection unit(110) is vertically combined with the rotation shaft and is connected to at least one pressure unit. The connection unit is positioned on the upper side of the hot plate or cleaning unit(90) according to the rotation of the rotation shaft.
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