发明名称 METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic electronic component capable of preventing cracks after baking by making multilayer performance excellent and suppressing a protrusion of a margin pattern end even if a binder contained in a green sheet or the margin pattern is insoluble. SOLUTION: The method for manufacturing a multilayer ceramic electronic component has a step of laminating a green sheet containing a butyral resin and inner electrode patterns to obtain a laminate. In this method, the polymerization degree of the butyral resin is≥350 but <1,000, a margin pattern is formed in the gap of the inner electrode patterns, electrode step absorbing paste has ceramic powder and a binder (ethyl cellulose and one or more selected from polymerization rosin, terpene phenol and an alicyclic group petroleum resin as a tackifier), the binder exceeding 3 pts.wt. and below 15 pts.wt. based on the ceramic powder of 100 pts.wt. is contained, and the ratio of the tackifier is 10-50 wt.% with respect to the content of the binder. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010067719(A) 申请公布日期 2010.03.25
申请号 JP20080231342 申请日期 2008.09.09
申请人 TDK CORP 发明人 ISHIYAMA TAMOTSU;FUKUOKA TOMOHISA;MORITA DAISUKE
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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