METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to improve an adhesion between a semiconductor chip and a resin by grinding the semiconductor chip. CONSTITUTION: A substrate(1) includes first electrodes(12) on a main surface. A semiconductor chip(4) includes second electrodes(11) on a first main surface. The first electrodes are electrically connected to the second electrodes. The substrate is electrically connected to the semiconductor chip. A second main surface is ground. A semiconductor chip is thinned. The sides of a semiconductor chip and the second main surface are sealed with a resin(5).