| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of semiconductor devices equipped with semiconductor elements of printed boards, ceramic substrates, and flexible sheets etc. as increase in thickness of supporting substrates causes the increase in the size of the semiconductor device and results in the structure from which heat of the semiconductor elements built in the device cannot be easily radiated. SOLUTION: After isolation grooves 14 are made in a conductive foil 60, circuit elements are mounted and insulation resin 10 is coated on the conductive foil 60 as a supporting substrate. This is reversed and the conductive foil with a supporting substrate of the insulation resin 10 is polished to isolate conductive paths 11. This method provides the semiconductor device 13 with the conductive paths 11 and semiconductor chip 12 backed by the insulation resin 10 without using a supporting substrate. Moreover, since the semiconductor chip 12 is fixed to be thermally connected to a first conductive path 11A, heat of the semiconductor chip 12 is radiated to the outside. COPYRIGHT: (C)2006,JPO&NCIPI |
