| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To peel a semiconductor chip from an adhesive sheet so as to prevent cracking even when the semiconductor chip is thin. <P>SOLUTION: A pick-up apparatus 1 has a stage 100 on which a dicing sheet 13 is placed, a slider which comes into contact with a back surface of the dicing sheet 13 and moves horizontally, in plan view, with respect to the semiconductor chip 12, a slider housing portion which is formed on the stage 100 and houses the slider, and a suction mechanism 500 which is coupled to the stage 100 and sucks the slider housing portion. On the stage 100, the dicing sheet 13 is placed in a position where the semiconductor chip 12 is opposed to the slider housing portion. The slider is provided with a plurality of slits on a side where the slider comes into contact with the dicing sheet 13. The slit is in communication with the slider housing portion 102. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
