发明名称 STRIP SUBSTRATE
摘要 PURPOSE: A strip substrate is provided to suppressing the flow of molding materials by forming a sweeping prevention unit along the edge of the strip substrate during a molding process for a fine pitch ball grid array package. CONSTITUTION: A substrate body(102) includes a plurality of substrate units(104) and includes segments including cavities(108) which is arranged on the center. A bar type sweeping prevention unit is arranged along the edge of the substrate body. The bar type sweeping preventing unit suppress the flow of molding materials. The edge of the substrate body includes both of a long side and a short side.
申请公布号 KR20100030504(A) 申请公布日期 2010.03.18
申请号 KR20080089476 申请日期 2008.09.10
申请人 HYNIX SEMICONDUCTOR INC. 发明人 JUNG, WON DUCK
分类号 H01L23/13 主分类号 H01L23/13
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