| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to protect a semiconductor chip from damaging or bending by performing a grinding process after the semiconductor package is stacked. CONSTITUTION: A first semiconductor chip(110) includes a first region(111) and a second region(113). The fist region includes a first recess part(119). The second region is arranged along the peripheral of the first region. A second semiconductor chip(120) includes a third region(121) including a second recess part and a forth region(123). The forth region is arranged along the peripheral of the third region. A third semiconductor chip(130) is arranged in the second recess part and includes connection terminals.
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