| 摘要 |
<p>PURPOSE: An LED package of COM type, an LED module using the same and a method for manufacturing the same are provided to improve heat resistance by directly adhering the chip of the LED package to a heat sink. CONSTITUTION: A metal plate(40) is coated on the upper side of a thermal conductive coating layer(40a). A printed circuit board is formed on the metal plate. A bonding pad(43) is formed to be exposed around the through hole of the printed circuit board. A insulation die(47) formed on the printed circuit board. An LED chip(44) is mounted on the exposed metal plate through the through hole. A bonding wire(45) electrically connects the LED chip and the bonding pad. A protective resin fills in the insulation die to cover the bonding wire.</p> |
