| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a nickel-gold plating method and a printed circuit board for forming a nickel-gold plating layer with superior quality at low cost while excessive substitution of nickel plating layer during electroless gold plating by using equipment in the prior art without additional equipment specially. <P>SOLUTION: The nickel-gold plating method is a method of performing electroless nickel-gold plating on an object, and includes a step of forming a first nickel plating layer on a surface of the object, a step of forming a second nickel plating layer on the first nickel plating layer, and a step of forming a gold plating layer on the second nickel plating layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
