SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that prevents damages to the surface of a substrate and a deterioration of processing power. SOLUTION: A substrate processing apparatus 1 includes: a rotating mechanism 5 for holding a substrate W having a surface to be processed and rotating it; a supply nozzle 6 for supplying a processing liquid to the surface to be processed of the substrate W rotated by the rotating mechanism 5; a mobile mechanism 7 for sequentially moving the supply nozzle 6 to a plurality of supply positions arranged toward the periphery of the substrate W; a measuring section 8 for measuring the liquid film thickness of the processing liquid on the surface to be processed; and a means for controlling the number of revolutions of the substrate W in such a manner that the liquid film thickness formed on the surface to be processed becomes constant by changing the number of revolutions of the substrate W for each of a plurality of supply positions according to the liquid film thickness measured by the measuring section 8. COPYRIGHT: (C)2010,JPO&INPIT