| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce time required for measuring the surface position of a substrate. <P>SOLUTION: An exposure apparatus is configured to do scanning on the substrate for measuring the surface position to expose the substrate by regulating the surface position of the substrate based on the results of the measurement. The exposure apparatus includes: a measuring unit provided with a plurality of sensors for measuring the surface positions of the substrate respectively at a plurality of measuring points aligned in a direction crossing the scanning direction of the substrate; and a control unit for allowing the measuring unit to measure the surface positions of the substrate by using all of the plurality of sensors when no device patterns are formed on the substrate, while allowing the measuring unit to measure the surface positions of the substrate by using all or some of the plurality of sensors according to the periodicity of a device pattern when the device pattern is formed on the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
