Semiconductor package and method for manufacturing thereof,申请号KR20070104534-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Semiconductor package and method for manufacturing thereof
摘要
申请公布号	KR100948163(B1)	申请公布日期	2010.03.17
申请号	KR20070104534	申请日期	2007.10.17
申请人		发明人
分类号	H01L23/28;H01L23/48	主分类号	H01L23/28
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Classification method

METHOD FOR RADIO SYSTEM RESOURCE MANAGEMENT

Truck with endless loop transmission for steering drive

COMPOUNDS, COMPOSITIONS AND METHODS

ANTIBACTERIAL AGENTS

PHARMACEUTICAL COMPOSITION COMBINING TENATOPRAZOLE AND A HISTAMINE H2-RECEPTOR ANTAGONIST

METHOD AND SYSTEM FOR CONFIGURATION AND DOWNLOAD IN A RESTRICTED ARCHITECTURE NETWORK

GAS TURBINE PLANT

MOVING BLADE AND GAS TURBINE USING SAME

EXHAUST DEVICE FOR MOTORCYCLE

SCROLL TYPE COMPRESSOR

GEAR PUMP AND BRAKE DEVICE

SPLICE PLATE INSTALLATION METAL FITTINGS AND CYLINDRICAL BODY MANUFACTURING METHOD

MOTOR-OPERATED TILE LAYING DEVICE

READY-MIXED CONCRETE POURING EQUIPMENT

CLEARANCE BLOCKING-UP TYPE VENTILATING INSECT PROOF NET FOR INSTALLING OPENING-OUT TYPE WINDOW

CATCHMENT AND WATER SPRINKLING SYSTEM STRUCTURE OF TRENCH CURBSTONE

CENTRIFUGAL PUMP