| 发明名称 |
TEILVERFAHREN FÜR SUBSTRAT AUS ZERBRECHLICHEM MATERIAL UND DAS VERFAHREN VERWENDENDE TEILVORRICHTUNG |
| 摘要 |
<p>The substrate made of the fragile material is scribed, after a protective element is applied onto a surface of the substrate. The cullet produced while cutting the substrate along the scribe line by forming a vertical crack extending deep into the substrate, is removed. An independent claim is also included for fragile substrate cutting device.</p> |
| 申请公布号 |
AT458597(T) |
申请公布日期 |
2010.03.15 |
| 申请号 |
AT20030715694T |
申请日期 |
2003.04.01 |
| 申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. |
发明人 |
MAEKAWA, KAZUYA;SOYAMA, HIROSHI |
| 分类号 |
B28D5/00;C03B33/033;C03B33/07;C03B33/10 |
主分类号 |
B28D5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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