| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the yield in an exposure device, an exposing method and a semiconductor manufacturing method. <P>SOLUTION: The exposure device includes a wafer mounting table 23 adjusting the inclination of a wafer W, a mask stage 12 holding an exposure mask 14, a projection optical system 35 projecting a mask pattern of the exposure mask 14 on the wafer W at a predetermined magnification, a measuring unit 30 measuring the tilt angle of an upper surface of the wafer W and a control unit 28 focusing the upper surface of the wafer W on a focal plane of the projection optical system 35 by adjusting the inclination of the wafer mounting table 23 based on the tilt angle. The control unit 28 corrects the magnification with a correction amount according to the tilt angle. <P>COPYRIGHT: (C)2010,JPO&INPIT |
