| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for encapsulation that has excellent workability because of high flowability, has excellent dependability of encapsulation because warpage is controlled in an encapsulation product, and protects a hollow structure of the encapsulation product. Ž<P>SOLUTION: This resin composition for encapsulation includes (A) an epoxy resin represented by general formula (1), (B) a specific aromatic amine curing agent, and (C) a silica powder as essential ingredients, wherein a flexural modulus at 180°C is ≥4.0 GPa. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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