发明名称 |
THERMOSETTING RESIN, THERMOSETTING COMPOSITION, LAMINATE FILM, AND LAMINATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin giving a cured product excellent in electric characteristics and stability against temperature change, and to provide a thermosetting composition and a laminate film each using the thermosetting resin. Ž<P>SOLUTION: This thermosetting resin includes at least one structure expressed by formula (1) (in the formula, R represents a substituent group including an epoxy group). The thermosetting composition includes the thermosetting resin and a curing agent. The laminate film 1 is equipped with a resin film 3 formed with the resin composition and a substrate film 2 on either surface of which the resin film 3 is laminated. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010053314(A) |
申请公布日期 |
2010.03.11 |
申请号 |
JP20080222423 |
申请日期 |
2008.08.29 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
NOMURA SHIGEKI;ABE HIROSHI;SHIBAYAMA KOICHI;MURATA TOMOAKI;KATO SEIICHI |
分类号 |
C08G59/02;B32B15/04;C08G59/20 |
主分类号 |
C08G59/02 |
代理机构 |
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主权项 |
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地址 |
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